San Jose -ʻo Samsung Electonics Co. E hoʻomaka i nā lawelawe koho back-3DER-First HBM4
I Iune 20, ua wehe nuiʻia ka chipmaker hoʻomanaʻo nui loa o ka honuaʻo ChipMaker i kānaʻenehanaʻo ChipSing a me nā alanuiʻo Samsung ma San Jose, Kaleponi.
ʻO ia ka manawa muaʻo Samsung e hoʻokuʻu i kaʻenehana 3D i kaʻenehana 3D i ka HBM i kahi hanana lehulehu. I kēia manawa, ua paʻa ka pahu HBM me kaʻenehana 2.5D.
Ua halaʻelua mau pule ma hope o nā hebedoma Nvidia CO-Figen a me ke Kuhina Nui o kāna mau mokuleleʻo Jain Firn i ka'ōlelo ma Taiwan i Taiwan.
Hiki iā HBM4 e hoʻopiliʻia ma NVediaʻO NVINIA's New Rubin Gpu
Kāleʻa uila
ʻO Samsung o Samsung o Samsung Hōʻike Hou nā Chips Glacted HBM i hoʻopaʻaʻia ma luna o kahi GPU i ke aʻoʻana a me ka hoʻokūkū hoʻokūkū hou.
I kēia manawa, ua pili pono nā hua HBM me kahi GPU ma kahiʻenehana Silipon ma lalo o kaʻenehanaʻo 2.5D.
Ma ka hoʻohālikelikeʻana,ʻaʻole koi i ka paleʻana i ka mea silicon, a iʻole he stitrate subste e noho ana ma waena o nā pōpoki e hiki ai ke kamaʻilio a hana pū kekahi. ʻO Samsung Dubs i kānaʻenehana papa hou e like me Saint-D, pōkole no Samsung Advannection Seckin-D.
OLELO HOOLAHA
Ua hoʻomaopopoʻia ka huiʻo South Korea e hāʻawi i ka hana 3d HBM i kahi kumu o ke kumu.
E hana pēlā, e hui pūʻia kāna hui pohō i ka hui o HBM ma kānaʻoihana hoʻomanaʻoʻana i kāna mau mea kūʻai aku.
"3d spetpenging i hōʻemi i ka mana o ka mana a me ke kaʻina hanaʻana, hoʻomaikaʻi i ka maikaʻi o nā hōʻailona o Semiconducket I 2027, hoʻolālāʻo Samsung e hoʻolauna i nāʻenehana hoʻohuihui a pau
I ka laina me ka koi e ulu ana no ka mana haʻahaʻa, nā kiʻi kiʻekiʻe,ʻo HBM e hana i ka 30,24, e like me kaʻoihana noiʻi Taiwan.
Hōʻikeʻo MGI Research i ka mākeke hana holomua holomua, me 3d scareging, e ulu i ka $ 80 miliona ma 2023.
Post Time: Jun-10-2024