SAN JOSE -- E hoʻolauna ʻo Samsung Electronics Co. i nā lawelawe hoʻopihapiha ʻekolu-dimensional (3D) no ka hoʻomanaʻo ʻana i ka bandwidth kiʻekiʻe (HBM) i loko o ka makahiki, kahi ʻenehana i manaʻo ʻia e hoʻolauna ʻia no ke kumu hoʻohālike ʻeono o ka hanauna o ka chip artificial intelligence HBM4 i 2025, e like me ka hui a me nā kumu waiwai.
Ma Iune 20, ua wehe ka mea hoʻomanaʻo hoʻomanaʻo nui loa o ka honua i kāna ʻenehana hōkeo chip hou a me nā palapala alanui lawelawe ma ka Samsung Foundry Forum 2024 i mālama ʻia ma San Jose, Kaleponi.
ʻO ia ka manawa mua e hoʻokuʻu ai ʻo Samsung i ka ʻenehana hōʻailona 3D no nā pahu HBM i kahi hanana lehulehu.I kēia manawa, hoʻopili nui ʻia nā pahu HBM me ka ʻenehana 2.5D.
Ua hiki mai ma kahi o ʻelua pule ma hope o ka hoʻokumu ʻana o Nvidia co-founder a me ka Luna Nui ʻo Jensen Huang i ka wehe ʻana i ka hoʻolālā hanauna hou o kāna platform AI Rubin i ka wā o kahi haʻiʻōlelo ma Taiwan.
E hoʻokomo ʻia ʻo HBM4 i ka hiʻohiʻona Rubin GPU hou o Nvidia i manaʻo ʻia e pā i ka mākeke ma 2026.
HOOLAHA VERTICAL
Hōʻike ka ʻenehana hōkeo hou o Samsung i nā pahu HBM i hoʻopaʻa ʻia ma luna o kahi GPU e hoʻolōʻihi i ka aʻo ʻana i ka ʻikepili a me ka hoʻoili ʻana i ka inference, kahi ʻenehana i manaʻo ʻia he mea hoʻololi pāʻani i ka mākeke chip AI e ulu wikiwiki ana.
I kēia manawa, hoʻopili ʻia nā pahu HBM me kahi GPU ma kahi interposer silicon ma lalo o ka ʻenehana hōkeo 2.5D.
Ma ka hoʻohālikelike ʻana, ʻaʻole koi ʻia ka pahu 3D i kahi interposer silicon, a i ʻole kahi substrate lahilahi e noho ana ma waena o nā chips e hiki ai iā lākou ke kamaʻilio a hana pū.Ua kapa ʻia ʻo Samsung i kāna ʻenehana hōkeo hou e like me SAINT-D, pōkole no Samsung Advanced Interconnection Technology-D.
HANA KUMU
Hoʻomaopopo ʻia ka hui ʻo South Korea e hāʻawi i ka 3D HBM packaging ma ke kumu turnkey.
No ka hana ʻana pēlā, e hoʻopili pololei ʻia kāna hui hoʻopihapiha kiʻekiʻe i nā ʻāpana HBM i hana ʻia ma kāna mahele ʻoihana hoʻomanaʻo me nā GPU i hōʻuluʻulu ʻia no nā ʻoihana fabless e kāna ʻāpana foundry.
"Ke hōʻemi nei ka paʻi 3D i ka hoʻohana ʻana i ka mana a me ka hoʻoponopono ʻana i nā lohi, e hoʻomaikaʻi ana i ka maikaʻi o nā hōʻailona uila o nā ʻāpana semiconductor," wahi a kahi luna Samsung Electronics.I ka makahiki 2027, hoʻolālā ʻo Samsung e hoʻolauna i ka ʻenehana hoʻohui heterogeneous āpau i hoʻohui i nā mea optical e hoʻonui nui i ka wikiwiki o ka lawe ʻana i nā semiconductors i loko o kahi pūʻulu hui pū o AI accelerators.
I ka laina me ka ulu nui o ka noi no ka haʻahaʻa haʻahaʻa, nā pahu hana kiʻekiʻe, ua manaʻo ʻia ʻo HBM e hana i 30% o ka mākeke DRAM ma 2025 mai 21% i 2024, e like me TrendForce, kahi hui noiʻi Taiwanese.
Ua wānana ʻo MGI Research i ka mākeke paʻi kiʻi kiʻekiʻe, me ka 3D packaging, e ulu i $ 80 biliona e 2032, hoʻohālikelike ʻia me $ 34.5 biliona ma 2023.
Ka manawa hoʻouna: Jun-10-2024