Ma Sepatemaba 13, 2024, ua hoʻolaha ʻo Resonac i ke kūkulu ʻana i kahi hale hana hou no nā wafers SiC (silicon carbide) no nā semiconductors mana ma kāna mea kanu ʻo Yamagata ma Higashine City, Yamagata Prefecture. Manaʻo ʻia ka hoʻopau ʻana i ka hapaha ʻekolu o 2025.
Aia ka hale hou i loko o ka Yamagata Plant o kāna hui, Resonac Hard Disk, a loaʻa iā ia kahi hale o 5,832 mau mika square. E hana ia i nā wafers SiC (substrates a me epitaxy). I Iune 2023, ua loaʻa iā Resonac ka palapala hōʻoia mai ka Ministry of Economy, Trade and Industry ma ke ʻano he ʻāpana o ka hoʻolālā hōʻoia no nā mea koʻikoʻi i koho ʻia ma lalo o ka Economic Security Promotion Act, kikoʻī no nā mea semiconductor (SiC wafers). ʻO ka hoʻolālā hoʻolako hoʻolako i ʻae ʻia e ka Ministry of Economy, Trade and Industry e koi ana i kahi hoʻopukapuka o 30.9 biliona yen e hoʻoikaika i ka mana hana wafer SiC ma nā kumu ma ke kūlanakauhale ʻo Oyama, Tochigi Prefecture; Kulanakauhale o Hikone, Shiga Prefecture; Higashine City, Yamagata Prefecture; a me Ichihara City, Chiba Prefecture, me nā haʻawina a hiki i ka 10.3 biliona yen.
Hoʻomaka ka hoʻolālā e hoʻolako i nā wafers SiC (substrates) i ke kūlanakauhale ʻo Oyama, Hikone City, a me Higashine City i ʻApelila 2027, me ka mana hana makahiki o 117,000 mau ʻāpana (e like me 6 iniha). Hoʻomaka ka hoʻolako ʻana i nā wafers epitaxial SiC i ke kūlanakauhale ʻo Ichihara a me Higashine City i Mei 2027, me ka mana o ka makahiki he 288,000 mau ʻāpana (ʻaʻole i loli).
Ma Sepatemaba 12, 2024, ua hoʻopaʻa ka hui i kahi hana hoʻoheheʻe honua ma ke kahua kūkulu i hoʻolālā ʻia ma ka hale ʻo Yamagata.
Ka manawa hoʻouna: Sep-16-2024