Ma ka lā 13 o Kepakemapa, 2024, ua hoʻolaha ʻo Resonac i ke kūkulu ʻia ʻana o kahi hale hana hou no nā wafers SiC (silicon carbide) no nā semiconductors mana ma kāna Hale Hana ʻo Yamagata ma ke kūlanakauhale ʻo Higashine, Yamagata Prefecture. Manaʻo ʻia ka hoʻopau ʻana i ka hapaha ʻekolu o 2025.
E waiho ʻia ka hale hana hou ma loko o ka Yamagata Plant o kāna lālā, ʻo Resonac Hard Disk, a he 5,832 mika kuea ka nui o ka hale. E hana ia i nā wafers SiC (substrates a me epitaxy). I Iune 2023, ua loaʻa iā Resonac ka palapala hōʻoia mai ke Kuhina o ka Hoʻokele Waiwai, Kālepa a me ka ʻOihana ma ke ʻano he ʻāpana o ka hoʻolālā hōʻoia lako no nā mea koʻikoʻi i koho ʻia ma lalo o ke Kānāwai Hoʻolaha Palekana Hoʻokele Waiwai, ʻoiai no nā mea semiconductor (SiC wafers). ʻO ka hoʻolālā hōʻoia lako i ʻae ʻia e ke Kuhina o ka Hoʻokele Waiwai, Kālepa a me ka ʻOihana e koi ana i kahi hoʻopukapuka kālā o 30.9 biliona yen e hoʻoikaika i ka hiki ke hana i ka wafer SiC ma nā kahua ma Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; a me Ichihara City, Chiba Prefecture, me nā kākoʻo a hiki i 10.3 biliona yen.
ʻO ka hoʻolālā e hoʻomaka i ka hoʻolako ʻana i nā wafers SiC (substrates) i ke kūlanakauhale ʻo Oyama, ke kūlanakauhale ʻo Hikone, a me ke kūlanakauhale ʻo Higashine i ʻApelila 2027, me ka hiki ke hana i kēlā me kēia makahiki he 117,000 mau ʻāpana (like me 6 ʻīniha). Ua hoʻonohonoho ʻia ka hoʻolako ʻana i nā wafers epitaxial SiC i ke kūlanakauhale ʻo Ichihara a me ke kūlanakauhale ʻo Higashine e hoʻomaka i Mei 2027, me ka hiki ke hana i kēlā me kēia makahiki he 288,000 mau ʻāpana (ʻaʻole i loli).
Ma ka lā 12 o Kepakemapa, 2024, ua mālama ka ʻoihana i kahi ʻaha hoʻolauleʻa honua ma ke kahua kūkulu i hoʻolālā ʻia ma ka Hale Hana ʻo Yamagata.
Ka manawa hoʻouna: Sep-16-2024